Microstrip Vias and Signal Integrity
CST Studio Suite modeling and parameter studies of via diameter, S-parameters, and time-domain reflectometry.
CST Studio SuitePCBS-parametersTDR
Research question
Vias in multilayer PCBs can introduce impedance discontinuities. This project examined how changes in microstrip via diameter affect reflection and transmission characteristics.
Method and contribution
I built the model in CST Studio Suite and adjusted simulation parameters. The study varied via diameter and used S-parameters and time-domain reflectometry (TDR) to examine impedance changes and signal integrity in high-speed transmission.
Outcome
Merit Award in the High-speed Transmission category of the 17th National Mobile Communications Project Competition.